TMS5703137DPGEQQ1

Mfr. #:: TMS5703137DPGEQQ1
설명:: ARM Microcontrollers - MCU Gladiator F021
수명 주기:: 이 제조업체의 새 제품입니다.
데이터 시트:: TMS5703137DPGEQQ1 데이터 시트
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추가 정보:: TMS5703137DPGEQQ1 추가 정보 TMS5703137DPGEQQ1 Product Details

제품 속성
속성 값

제조사:: 텍사스 인스트루먼트

제품 카테고리:: ARM 마이크로컨트롤러 - MCU

RoHS:: Y

장착 스타일:: SMD/SMT

패키지/케이스:: LQFP-144

시리즈:: TMS570LS3137

핵심:: ARM Cortex R4F

데이터 버스 폭:: 32 bit/16 bit

최대 클록 주파수:: 160 MHz

프로그램 메모리 크기:: 3072 kB

데이터 RAM 크기:: 256 kB

ADC 해상도:: 12 bit

입출력 수:: 58 I/O

작동 공급 전압:: 1.2 V

최소 작동 온도:: - 40 C

최대 작동 온도:: + 125 C

자격:: AEC-Q100

제품:: MCU

프로그램 메모리 유형:: 플래시

상표:: 텍사스 인스트루먼트

데이터 램 유형:: 램

데이터 ROM 크기:: 64 kB

데이터 ROM 유형:: EEPROM

인터페이스 유형:: CAN, I2C, SCI/LIN, SPI

아날로그 공급 전압:: 3 V to 5.25 V

입출력 전압:: 3.3 V

습기에 민감한:: 네

ADC 채널 수:: 24 Channel

상품 유형:: ARM 마이크로컨트롤러 - MCU

공장 팩 수량:: 60

하위 카테고리:: 마이크로컨트롤러 - MCU

공급 전압 - 최대:: 1.32 V

공급 전압 - 최소:: 1.14 V

감시 타이머:: 감시 타이머

단위 무게:: 0.045652 oz

Tags: TMS5703137, TMS5703, TMS570, TMS57, TMS5, TMS

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
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we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

TMS5703137DPGEQQ1 설명

***as Instruments: 16/32 Bit RISC Flash MCU, Arm Cortex-R4F, EMAC, FlexRay 144-LQFP -40 to 125

***et Europe: MCU 16-Bit/32-Bit Hercules TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 144-Pin LQFP

***ical: MCU 16-bit/32-bit ARM Cortex R4F RISC 3MB Flash 1.2V/3.3V Automotive 144-Pin LQFP

***i-Key: IC MCU 32BIT 3MB FLASH 144LQFP

***ark: Gladiator F021

***AS USD: The TMS570LS3137 device is a high-performance automotive-grade microcontroller family for safety systems. The safety architecture includes dual CPUs in lockstep, CPU and memory BIST logic, ECC on both the flash and the data SRAM, parity on peripheral memories, and loopback capability on peripheral I/Os.

***ASIN: The TMS570LS3137 device integrates the ARM Cortex-R4F Floating-Point CPU. The CPU offers an efficient 1.66 DMIPS/MHz, and has configurations that can run up to 180 MHz, providing up to 298 DMIPS. The device supports the word-invariant big-endian [BE32] format.

***AS INSTRU: The TMS570LS3137 device has 3MB of integrated flash and 256KB of data RAM. Both the flash and RAM have single-bit error correction and double-bit error detection. The flash memory on this device is a nonvolatile, electrically erasable, and programmable memory implemented with a 64-bit-wide data bus interface. The flash operates on a 3.3-V supply input (same level as I/O supply) for all read, program, and erase operations. When in pipeline mode, the flash operates with a system clock frequency of up to 180 MHz. The SRAM supports single-cycle read and write accesses in byte, halfword, word, and double-word modes.

***AS USD: The TMS570LS3137 device features peripherals for real-time control-based applications, including two Next Generation High-End Timer (N2HET) timing coprocessors and two 12-bit Analog-to-Digital Converters (ADCs) supporting up to 24 inputs.

***AS INSTR: The N2HET is an advanced intelligent timer that provides sophisticated timing functions for real-time applications. The timer is software-controlled, using a reduced instruction set, with a specialized timer micromachine and an attached I/O port. The N2HET can be used for pulse-width-modulated outputs, capture or compare inputs, or GPIO. The N2HET is especially well suited for applications requiring multiple sensor information and drive actuators with complex and accurate time pulses. A High-End Timer Transfer Unit (HTU) can perform DMA-type transactions to transfer N2HET data to or from main memory. A Memory Protection Unit (MPU) is built into the HTU.

***XS: The device has two 12-bit-resolution MibADCs with 24 channels and 64 words of parity-protected buffer RAM each. The MibADC channels can be converted individually or can be grouped by software for sequential conversion sequences. Sixteen channels are shared between the two MibADCs. There are three separate groupings. Each sequence can be converted once when triggered or configured for continuous conversion mode. The MibADC has a 10-bit mode for use when compatibility with older devices or faster conversion time is desired.

***AS INS: The device has multiple communication interfaces: three MibSPIs, two SPIs, one LIN, one SCI, three DCANs, one I2C module, one Ethernet, and one FlexRay controller. The SPIs provide a convenient method of serial high-speed communication between similar shift-register type devices. The LIN supports the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard Non-Return-to-Zero (NRZ) format.

***AS INSTRU: The DCAN supports the CAN 2.0 (A and B) protocol standard and uses a serial, multimaster communication protocol that efficiently supports distributed real-time control with robust communication rates of up to 1 Mbps. The DCAN is ideal for systems operating in noisy and harsh environments (for example, automotive vehicle networking and industrial fieldbus) that require reliable serial communication or multiplexed wiring.

***TEXAS: The FlexRay controller uses a dual-channel serial, fixed time base multimaster communication protocol with communication rates of 10 Mbps per channel. A FlexRay Transfer Unit (FTU) enables autonomous transfers of FlexRay data to and from the CPU main memory. Transfers are protected by a dedicated, built-in MPU. The Ethernet module supports MII, RMII, and MDIO interfaces.

***as Instruments (TI): The I2C module is a multimaster communication module providing an interface between the microcontroller and an I2C-compatible device through the I2C serial bus. The I2C supports speeds of 100 and 400 Kbps.

***: The Frequency-Modulated Phase-Locked Loop (FMPLL) clock module is used to multiply the external frequency reference to a higher frequency for internal use. There are two FMPLL modules on this device. These modules, when enabled, provide two of the seven possible clock source inputs to the Global Clock Module (GCM). The GCM manages the mapping between the available clock sources and the device clock domains.

***AS INS: The device also has an External Clock Prescaler (ECP) module that when enabled, outputs a continuous external clock on the ECLK pin (or ball). The ECLK frequency is a user-programmable ratio of the peripheral interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of the device operating frequency.

***AS INSRUMENT: The DMA controller has 16 channels, 32 control packets, and parity protection on its memory. An MPU is built into the DMA to limit the DMA to prescribed areas of memory and to protect the rest of the memory system from any malfunction of the DMA.

***: The Error Signaling Module (ESM) monitors all device errors and determines whether an interrupt is generated or the external ERROR pin is toggled when a fault is detected. The ERROR pin can be monitored externally as an indicator of a fault condition in the microcontroller.

***AS INSRUMENTS: The External Memory Interface (EMIF) provides off-chip expansion capability with the ability to interface to synchronous DRAM (SDRAM) devices, asynchronous memories, peripherals or FPGA devices.

***AS INSTRU: Several interfaces are implemented to enhance the debugging capabilities of application code. In addition to the built-in ARM Cortex-R4F CoreSight debug features, an External Trace Macrocell (ETM) provides instruction and data trace of program execution. For instrumentation purposes, a RAM Trace Port (RTP) module is implemented to support high-speed tracing of RAM and peripheral accesses by the CPU or any other master. A Data Modification Module (DMM) gives the ability to write external data into the device memory. Both the RTP and DMM have no or only minimum impact on the program execution time of the application code. A Parameter Overlay Module (POM) can reroute flash accesses to internal memory or to the EMIF. This rerouting allows the dynamic calibration against production code of parameters and tables without rebuilding the code to explicitly access RAM or halting the processor to reprogram the data flash.

***AS INSTRUM: With integrated safety features and a wide choice of communication and control peripherals, the TMS570LS3137 device is an ideal solution for high-performance real-time control applications with safety-critical requirements.

TMS5703137DPGEQQ1 추가 정보

Processors: OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.

TMS570LS3137 RISC Flash Microcontrollers: OMO Electronic TMS570LS3137 16/32-Bit RISC Flash Microcontrollers provide safety architecture in a high-performance automotive-grade microcontroller designed for safety systems. The safety architecture incorporates ECC on both the flash and the data SRAM, CPU and memory BIST logic, parity on peripheral memories, loop-back capability on peripheral I/Os, and dual CPUs in lockstep. The TMS570LS3137 integrates the ARM Cortex-R4F Floating-Point CPU, which utilizes an efficient 1.66DMIPS/MHz. The CPU provides up to 298 DMIPS through the use of configurations that can run up to 180MHz. 3MB of integrated flash, along with 256KB of data RAM offer single-bit error correction and double-bit error detection on the device. Other features include a variety of communication interfaces three MibSPIs, two SPIs, one LIN, one SCI, three DCANs, one I2C module, one Ethernet, and one FlexRay controller.

Market price

부분 #	설명	재고	가격
TMS5703137DPGEQQ1 DISTI # V39:1801_07405625	MCU 16-bit/32-bit ARM Cortex R4F RISC 3MB Flash 1.2V/3.3V Automotive 144-Pin LQFP RoHS: Compliant	58	9000:$21.4700 6000:$21.5000 3000:$21.5200 60:$25.6500
TMS5703137DPGEQQ1 DISTI # 296-42452-ND	IC MCU 32BIT 3MB FLASH 144LQFP RoHS: Compliant Min Qty: 1 Container: Tray	2580In Stock	120:$24.6574 60:$27.5773 10:$28.8750 1:$31.3100
TMS5703137DPGEQQ1 DISTI # 29064468	MCU 16-bit/32-bit ARM Cortex R4F RISC 3MB Flash 1.2V/3.3V Automotive 144-Pin LQFP RoHS: Compliant	116	58:$25.6500
TMS5703137DPGEQQ1 DISTI # TMS5703137DPGEQQ1	MCU 16-Bit/32-Bit Hercules TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 144-Pin LQFP (Alt: TMS5703137DPGEQQ1) RoHS: Compliant Min Qty: 60	Europe - 360	60:€25.7900 120:€23.2900 240:€21.1900 360:€20.3900 600:€19.4900
TMS5703137DPGEQQ1 DISTI # TMS5703137DPGEQQ1	MCU 16-Bit/32-Bit Hercules TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 144-Pin LQFP - Trays (Alt: TMS5703137DPGEQQ1) RoHS: Compliant Min Qty: 60 Container: Tray	Americas - 0	60:$26.9900 120:$26.3900 240:$25.2900 360:$24.6900 600:$24.2900
TMS5703137DPGEQQ1	16/32 Bit RISC Flash MCU, Arm Cortex-R4F, EMAC, FlexRay	1324	1000:$18.4300 750:$18.4900 500:$20.6000 250:$21.9000 100:$22.0600 25:$24.8200 10:$25.6300 1:$27.4200
TMS5703137DPGEQQ1 DISTI # 595-MS5703137DPGEQQ1	ARM Microcontrollers - MCU 16- and 32-Bit RISC Flash Microcontroller 144-LQFP -40 to 125 RoHS: Compliant	328	1:$31.3100 5:$30.0200 10:$28.8800 25:$27.5800 100:$24.6600 250:$23.5300
TMS5703137DPGEQQ1 DISTI # XSKDRABV0029125	RoHS: Compliant	60	60:$46.2500

영상	부분 #	설명
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	Mfr.#: DLW43SH510XK2L OMO.#: OMO-DLW43SH510XK2L	Common Mode Chokes / Filters 1812 51uH@1MHz Tol -30%/+50%
	Mfr.#: TMDSEMU560V2STM-UE OMO.#: OMO-TMDSEMU560V2STM-UE	Emulators / Simulators XDS560 Class High Speed Emulators
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	Mfr.#: TMDS570LS31HDK OMO.#: OMO-TMDS570LS31HDK-TEXAS-INSTRUMENTS	TMS570LS EVAL BRD

TMS5703137DPGEQQ1

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes