EP3C55F484C6N

Mfr. #:: EP3C55F484C6N
제조사:: Intel
설명:: IC FPGA 327 I/O 484FBGA Cyclone III
수명 주기:: 이 제조업체의 새 제품입니다.
데이터 시트:: EP3C55F484C6N 데이터 시트
배달:: DHL FedEx Ups TNT EMS
지불:: T/T Paypal Visa MoneyGram Western Union
ECAD Model:
추가 정보:: EP3C55F484C6N 추가 정보

제품 속성
속성 값

제조사: 알테라

제품 카테고리: IC 칩

시리즈: 사이클론 III

제품: 사이클론 III

포장: 쟁반

장착 스타일: SMD/SMT

상표명: 사이클론 III

패키지 케이스: FBGA-484

작동 온도: 0°C ~ 85°C (TJ)

장착형: 표면 실장

전압 공급: 1.15 V ~ 1.25 V

공급자-장치-패키지: 484-FBGA (23x23)

게이트 수: -

IO 수: 327

LAB 수-CLB: 3491

논리 요소 셀 수: 55856

총 RAM 비트: 2396160

최대 작동 온도: + 70 C

최소 작동 온도: 0 C

작동-공급-전압: 1.15 V to 1.25 V

최대 작동 주파수: 315 MHz

입출력 수: 327 I/O

로직 어레이 블록 수 LAB: 3491

논리 요소 수: 55856

총 메모리: 2396160 bit

Tags: EP3C55F484C6N, EP3C55F484C6, EP3C55F484C, EP3C55F4, EP3C55F, EP3C55, EP3C5, EP3C, EP3

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

EP3C55F484C6N 설명

***ical: FPGA Cyclone® III Family 55856 Cells 500MHz 65nm Technology 1.2V 484-Pin FBGA

***i-Key: IC FPGA 327 I/O 484FBGA

EP3C55F484C6N 추가 정보

Cyclone® III FPGAs: Altera Cyclone® III FPGAs offer an unprecedented combination of low power, high functionality, and low cost to maximize your competitive edge. The features and architecture of the Altera Cyclone III FPGA family provides the ideal solution for your high-volume, low-power, cost-sensitive applications. With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. To address your unique design needs, this FPGA family offers two variants: Cyclone III provides the lowest power and high functionality with the lowest cost. Cyclone III LS provides the lowest power FPGAs with security.Learn More

Cyclone® Family FPGAs: Intel Cyclone® Family FPGAs are built to meet your low-power, cost-sensitive design needs, enabling you to get to market faster. Each generation of Cyclone FPGAs solves the technical challenges of increased integration, increased performance, lower power, and faster time to market while meeting cost-sensitive requirements. Intel Cyclone V FPGAs provide the market's lowest system cost and lowest power FPGA solution for applications in the industrial, wireless, wireline, broadcast, and consumer markets. The family integrates an abundance of hard intellectual property (IP) blocks to enable you to do more with less overall system cost and design time. The SoC FPGAs in the Cyclone V family offer unique innovations such as a hard processor system (HPS) centered around the dual-core ARM® Cortex™-A9 MPCore™ processor with a rich set of hard peripherals to reduce system power, system cost, and board size. Intel Cyclone IV FPGAs are the lowest cost, lowest power FPGAs, now with a transceiver variant. The Cyclone IV FPGA family targets high volume, cost-sensitive applications, enabling you to meet increasing bandwidth requirements while lowering costs. Intel Cyclone III FPGAs offer an unprecedented combination of low cost, high functionality, and power optimization to maximize your competitive edge. The Cyclone III FPGA family is manufactured using Taiwan Semiconductor Manufacturing Company's low-power process technology to deliver low power consumption at a price that rivals that of ASICs. Intel Cyclone II FPGAs are built from the ground up for low cost and to provide a customer-defined feature set for high volume, cost-sensitive applications. Intel Cyclone II FPGAs deliver high performance and low power consumption at a cost that rivals that of ASICs.Learn More

Market price

부분 #	제조	설명	재고	가격
EP3C55F484C6N DISTI # 544-2508-ND	Intel Corporation	IC FPGA 327 I/O 484FBGA RoHS: Compliant Min Qty: 1 Container: Tray	9In Stock	1:$265.3700
EP3C55F484C6N DISTI # 989-EP3C55F484C6N	Intel Corporation	FPGA - Field Programmable Gate Array FPGA - Cyclone III 3491 LABs 327 IOs RoHS: Compliant	49	1:$265.3700
EP3C55F484C6N	Altera Corporation		12	9:$467.2650 6:$498.4160 1:$545.1425
EP3C55F484C6N	Altera Corporation		0
EP3C55F484C6N	Altera Corporation	INSTOCK	40952
EP3C55F484C6NGA-DUAL USE P.		INSTOCK	1

관련 상품

영상	부분 #	설명
	Mfr.#: EP3C55F484C8N OMO.#: OMO-EP3C55F484C8N	FPGA - Field Programmable Gate Array FPGA - Cyclone III 3491 LABs 327 IOs
	Mfr.#: EP3C55U484I7N OMO.#: OMO-EP3C55U484I7N	FPGA - Field Programmable Gate Array FPGA - Cyclone III 3491 LABs 327 IOs
	Mfr.#: EP3C55F484I7 OMO.#: OMO-EP3C55F484I7	FPGA - Field Programmable Gate Array FPGA - Cyclone III 3491 LABs 327 IOs
	Mfr.#: EP3C55U484C7N OMO.#: OMO-EP3C55U484C7N	FPGA - Field Programmable Gate Array FPGA - Cyclone III 3491 LABs 327 IOs
	Mfr.#: EP3C55F780C8 OMO.#: OMO-EP3C55F780C8-INTEL	IC FPGA 377 I/O 780FBGA Cyclone III
	Mfr.#: EP3C55U484C7N OMO.#: OMO-EP3C55U484C7N-INTEL	IC FPGA 327 I/O 484UBGA Cyclone III
	Mfr.#: EP3C55F780C7N OMO.#: OMO-EP3C55F780C7N-INTEL	IC FPGA 377 I/O 780FBGA Cyclone III
	Mfr.#: EP3C55F484C6N OMO.#: OMO-EP3C55F484C6N-INTEL	IC FPGA 327 I/O 484FBGA Cyclone III
	Mfr.#: EP3C55F484 OMO.#: OMO-EP3C55F484-1190	신규 및 오리지널
	Mfr.#: EP3C55U484C8NES OMO.#: OMO-EP3C55U484C8NES-1190	신규 및 오리지널

유효성

재고:: Available
주문 시:: 5500
수량 입력:

EP3C55F484C6N의 현재 가격은 참고용이며 최상의 가격을 원하시면 판매팀 [email protected]으로 문의 또는 다이렉트 이메일을 보내주십시오.

참고 가격(USD)

수량
단가
내선 가격

1: ~~US$398.06~~; ~~US$398.06~~

10: ~~US$378.15~~; ~~US$3 781.52~~

100: ~~US$358.25~~; ~~US$35 824.95~~

500: ~~US$338.35~~; ~~US$169 173.40~~

1000: ~~US$318.44~~; ~~US$318 444.00~~

2021년부터 반도체 공급 부족으로 인해 아래 가격은 2021년 이전 정상 가격입니다. 확인을 위해 문의를 보내주세요.

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EP3C55F484C6N

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes