TMX5703137APGEQQ1

Mfr. #:: TMX5703137APGEQQ1
설명:: IC MCU 32BIT 3MB FLASH 144LQFP
수명 주기:: 이 제조업체의 새 제품입니다.
데이터 시트:: TMX5703137APGEQQ1 데이터 시트
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추가 정보:: TMX5703137APGEQQ1 추가 정보 TMX5703137APGEQQ1 Product Details

제품 속성
속성 값

제조사: 텍사스 인스트루먼트

제품 카테고리: 임베디드 - 마이크로컨트롤러

시리즈: Automotive, AEC-Q100, Hercules TMS570 ARMR CortexR-R

포장: 쟁반

패키지 케이스: 144-LQFP

작동 온도: -40°C ~ 125°C (TA)

공급자-장치-패키지: 144-LQFP (20x20)

IO 수: 58

속도: 160MHz

EEPROM-크기: 64K x 8

코어 프로세서

RAM 크기: 256K x 8

프로그램 메모리 유형: 플래시

주변기기: DMA, POR, PWM, WDT

연결성: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, MibSPI, SCI, SPI, UART/USART

전압-공급-Vcc-Vdd: 1.14 V ~ 3.6 V

코어 크기: 16/32-Bit

프로그램 메모리 크기: 3MB (3M x 8)

데이터 변환기: A/D 24x12b

발진기 유형: 외부의

Tags: TMX5703137, TMX5703, TMX570, TMX57, TMX5, TMX

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

TMX5703137APGEQQ1 설명

***et Europe: MCU 16-bit/32-bit TMS570LS ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 144-Pin LQFP Tray

***as Instruments: 16/32-Bit RISC Flash Microcontroller 144-LQFP -40 to 125

***i-Key: MCU 16/32Bit FLASH 3MB 144LQFP

***ark: MCU, 32BIT, ARM CORTEX-R4F, 160MHZ, LQFP-144; Core Size:32bit; No. of I/O's:58; Program Memory Size:3MB; EEPROM Memory Size:64KB; RAM Memory Size:256KB; CPU Speed:160MHz; Oscillator Type:External, Internal; No. of Timers:2 ;RoHS Compliant: Yes

***ment14 APAC: IC, MCU, 16/32BIT, FLASH 3MB, 144LQFP; Core Size:32bit; No. of I/O's:58; Program Memory Size:3MB; EEPROM Memory Size:64KB; RAM Memory Size:256KB; CPU Speed:160MHz; Oscillator Type:External, Internal; No. of Timers:2; Peripherals:ADC, CRC, DMA; Embedded Interface Type:CAN, I2C, SPI, UART; Digital IC Case Style:LQFP; Supply Voltage Range:1.14V to 1.32V; Operating Temperature Range:-40°C to +125°C; No. of Pins:144; SVHC:No SVHC (19-Dec-2011)

Market price

부분 #	설명	재고	가격
TMX5703137APGEQQ1 DISTI # 296-29388-ND	IC MCU 32BIT 3MB FLASH 144LQFP RoHS: Compliant Min Qty: 13 Container: Tray	Limited Supply - Call
TMX5703137APGEQQ1 DISTI # 595-MX5703137APGEQQ1	ARM Microcontrollers - MCU HERCULES MCU RoHS: Not compliant	0

관련 상품

영상	부분 #	설명
	Mfr.#: TMX5703137APGEQQ1 OMO.#: OMO-TMX5703137APGEQQ1	ARM Microcontrollers - MCU HERCULES MCU
	Mfr.#: TMX5703134APGEQQ1 OMO.#: OMO-TMX5703134APGEQQ1-1190	* FREE SHIPPING ORDERS OVER $100 *
	Mfr.#: TMX5703136APGEQQ1 OMO.#: OMO-TMX5703136APGEQQ1-1190	신규 및 오리지널
	Mfr.#: TMX5703137APGEQQ1 OMO.#: OMO-TMX5703137APGEQQ1-TEXAS-INSTRUMENTS	IC MCU 32BIT 3MB FLASH 144LQFP
	Mfr.#: TMX5703134BPGEQQ1 OMO.#: OMO-TMX5703134BPGEQQ1-TEXAS-INSTRUMENTS	Microcontrollers - MCU ARM Microcontrollers - MCU 16/32B RISC Flash MCU
	Mfr.#: TMX5703137AZWTQQ1 OMO.#: OMO-TMX5703137AZWTQQ1-TEXAS-INSTRUMENTS	IC MCU 32BIT 3MB FLASH 337NFBGA Automotive, AEC-Q100, Hercules TMS570 ARM Cortex-R
	Mfr.#: TMX5703137BPGEQQ1 OMO.#: OMO-TMX5703137BPGEQQ1-TEXAS-INSTRUMENTS	IC MCU 32BIT 3MB FLASH 144LQFP
	Mfr.#: TMX5703137BZWTQQ1 OMO.#: OMO-TMX5703137BZWTQQ1-TEXAS-INSTRUMENTS	IC MCU 32BIT 3MB FLASH 337NFBGA Automotive, AEC-Q100, Hercules TMS570 ARM Cortex-R

유효성

재고:: Available
주문 시:: 5500
수량 입력:

TMX5703137APGEQQ1의 현재 가격은 참고용이며 최상의 가격을 원하시면 판매팀 [email protected]으로 문의 또는 다이렉트 이메일을 보내주십시오.

참고 가격(USD)

수량
단가
내선 가격

1: ~~US$0.00~~; ~~US$0.00~~

10: ~~US$0.00~~; ~~US$0.00~~

100: ~~US$0.00~~; ~~US$0.00~~

500: ~~US$0.00~~; ~~US$0.00~~

1000: ~~US$0.00~~; ~~US$0.00~~

시작

TMX5703137 4
TMX5703 7
TMX570 30
TMX57 41
TMX5 45
TMX 620

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TMX5703137APGEQQ1

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes