669-33ABT3

669-33ABT3
Mfr. #:
669-33ABT3
제조사:
Wakefield-Vette
설명:
Heat Sinks SpeedClip Heat Sink Assembly for Intel IDX4, AMD; 17x17 SPGA
수명 주기:
이 제조업체의 새 제품입니다.
데이터 시트:
669-33ABT3 데이터 시트
배달:
DHL FedEx Ups TNT EMS
지불:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
669-33ABT3 Datasheet
ECAD Model:
제품 속성
속성 값
제조사:
웨이크필드-베트
제품 카테고리:
방열판
상표:
웨이크필드-베트
상품 유형:
방열판
하위 카테고리:
방열판
Tags
669-3, 669
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
BOARD LEVEL HEAT SINK - SPEEDCLIP HEAT SINK ASSEMBLY FOR INTEL IDX4, AMD; 17X17 SPGA
***i-Key
HEATSINK ASSY FOR SPGA
***hardson RFPD
BOARD LEVEL HEAT SINK
영상 부분 # 설명
669-33ABT3

Mfr.#: 669-33ABT3

OMO.#: OMO-669-33ABT3

Heat Sinks SpeedClip Heat Sink Assembly for Intel IDX4, AMD; 17x17 SPGA
669-3-R100KD

Mfr.#: 669-3-R100KD

OMO.#: OMO-669-3-R100KD-1190

신규 및 오리지널
유효성
재고:
Available
주문 시:
5500
수량 입력:
669-33ABT3의 현재 가격은 참고용이며 최상의 가격을 원하시면 판매팀 [email protected]으로 문의 또는 다이렉트 이메일을 보내주십시오.
시작
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