TSM-104-01-F-DV-P-TR

TSM-104-01-F-DV-P-TR
Mfr. #:
TSM-104-01-F-DV-P-TR
제조사:
Samtec
설명:
Headers & Wire Housings .100" Surface Mount Terminal Strip
수명 주기:
이 제조업체의 새 제품입니다.
데이터 시트:
TSM-104-01-F-DV-P-TR 데이터 시트
배달:
DHL FedEx Ups TNT EMS
지불:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
TSM-104-01-F-DV-P-TR Datasheet
ECAD Model:
제품 속성
속성 값
제조사:
삼텍
제품 카테고리:
헤더 및 와이어 하우징
RoHS:
Y
제품:
헤더
직위 수:
4 Position
정점:
2.54 mm
행 수:
2 Row
종료 스타일:
구멍을 통해
장착 각도:
직각
접촉 도금:
시리즈:
TSM
포장:
상표:
삼텍
접촉 재료:
인청동
최대 작동 온도:
+ 125 C
최소 작동 온도:
- 55 C
상품 유형:
헤더 및 와이어 하우징
공장 팩 수량:
200
하위 카테고리:
헤더 및 와이어 하우징
Tags
TSM-104-01-F-DV, TSM-104-01-F-D, TSM-104-01-F, TSM-104-01, TSM-104, TSM-10, TSM-1, TSM
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***y Electronics
TSM - Samtec 2.54mm Dual Row Vertical Surface Mount Header 5.84mm Post Height (01) - Fast Stock
***et
Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST SMD T/R
***er Electronics
Headers & Wire Housings .100 Surface Mount Terminal Strip
***tec
This surface mount .025” square post terminal strip features single, double and triple row options with straight, right-angle or mixed technology pins. This is an Extended Life Product™, passing 10 year Mixed Flowing Gas (MFG) and achieving high mating cycles (250 to 2,500).
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유효성
재고:
531
주문 시:
2514
수량 입력:
TSM-104-01-F-DV-P-TR의 현재 가격은 참고용이며 최상의 가격을 원하시면 판매팀 [email protected]으로 문의 또는 다이렉트 이메일을 보내주십시오.
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