75705-3503

75705-3503
Mfr. #:
75705-3503
제조사:
Molex
설명:
High Speed / Modular Connectors 11X5 BP HDR GUIDE LEFT
수명 주기:
이 제조업체의 새 제품입니다.
데이터 시트:
75705-3503 데이터 시트
배달:
DHL FedEx Ups TNT EMS
지불:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
제품 속성
속성 값
제조사:
몰렉스
제품 카테고리:
고속 / 모듈식 커넥터
RoHS:
Y
직위 수:
110 Position
행 수:
11 Row
정점:
1.85 mm
종료 스타일:
구멍을 통해
접촉 도금:
시리즈:
75705
포장:
쟁반
현재 등급:
1 A
하우징 재질:
열가소성 물질
장착 각도:
수직의
전압 등급:
120 VAC/DC
상표:
몰렉스
접촉 재료:
주석
최대 작동 온도:
+ 80 C
최소 작동 온도:
- 55 C
상품 유형:
고속 / 모듈식 커넥터
공장 팩 수량:
88
하위 카테고리:
백플레인 커넥터
상표명:
GbX I-트랙
부품 번호 별칭:
0757053503
단위 무게:
0.256548 oz
Tags
75705-3, 75705, 7570, 757
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et Europe
Conn Backplane HDR 110 POS 3.7mm Press Fit ST Thru-Hole Tray
***ical
Conn Backplane HDR 110 POS 3.7mm Solder ST Thru-Hole Tray
***ser
I-TRAC Backplane Connectors 11X5 BP HDR GUIDE LEFT
***pNet
CONN HEADER 110POS 11ROW VERT AU
***lind Electronics
I-TRAC BACKPLANE ASSY - 5 COL LEFT - TIN
***ex
GbX I-Trac™ Vertical Header Module, 1.85mm by 3.70mm Pitch, Left Guide, Right Open, 11 Rows, 5 Columns, 110 Circuits, Mating Pin Length 4.70mm
***ronik
110P GBX I-TRAC HEADER STRAIGHT
***ark
Backplane connector; Connector Type:Hard Metric (HM); Gender:Header; No. of Contacts:110; Pitch Spacing:3.7mm; Contact Termination:Solder; Contact Material:Copper Alloy; Series:I-Trac; Contact Plating:Gold; No. of Rows:11 ;RoHS Compliant: Yes
***nell
CONNECTOR, BACKPLANE 110WAY; Connector Type:Backplane; Gender:Male; Ways, No. of:110; Lead Spacing:3.7mm; Termination Method:Solder; Contact Material:Copper Alloy; Series:I-Trac; Contact Plating:Gold; No. of Rows:11; Row Pitch:3.7mm; Approval Bodies:UL; Current Rating:1A; Material:LCP; Max Operating Temperature:85°C; Min Temperature Operating:-55°C; No. of Mating Cycles:200
***ment14 APAC
CONNECTOR, BACKPLANE 110WAY; Connector Type:Backplane; Row Pitch:3.7mm; Series:I-Trac; Pitch Spacing:3.7mm; No. of Contacts:110; Gender:Header; Contact Termination:Through Hole Vertical; No. of Rows:11; Contact Plating:Gold; Contact Material:Copper; Approval Bodies:UL; Contact Material:Copper Alloy; Current Rating:1A; Lead Spacing:3.7mm; Material:LCP; No. of Mating Cycles:200; No. of Ways:110; Operating Temperature Max:85°C; Operating Temperature Min:-55°C; Termination Method:Solder
부분 # 제조 설명 재고 가격
75705-3503
DISTI # 75705-3503-ND
MolexCONN HEADER I-TRAC 110POS PCB
RoHS: Compliant
Min Qty: 44
Container: Tray
Limited Supply - Call
    0757053503
    DISTI # 0757053503
    MolexConn Backplane HDR 110 POS 3.7mm Press Fit ST Thru-Hole Tray - Trays (Alt: 0757053503)
    RoHS: Compliant
    Min Qty: 88
    Container: Tray
    Americas - 0
      75705-3503
      DISTI # 538-75705-3503
      MolexHigh Speed / Modular Connectors 11X5 BP HDR GUIDE LEFT
      RoHS: Compliant
      0
      • 88:$12.3600
      • 176:$11.6800
      • 264:$10.8100
      • 528:$9.9600
      75705-3503
      DISTI # 1548373
      Molex 
      RoHS: Compliant
      0
      • 250:$16.5500
      • 100:$17.8900
      • 50:$18.9300
      • 25:$20.0600
      • 10:$22.0800
      • 1:$23.1400
      영상 부분 # 설명
      75705-1103

      Mfr.#: 75705-1103

      OMO.#: OMO-75705-1103

      High Speed / Modular Connectors 11X10 BP HDR UNGUIDED
      75705-3603

      Mfr.#: 75705-3603

      OMO.#: OMO-75705-3603

      High Speed / Modular Connectors 11X6 BP HDR GUIDE LEFT
      75705-1633

      Mfr.#: 75705-1633

      OMO.#: OMO-75705-1633-713

      High Speed / Modular Connectors I-TRAC BP ASSY - 6 C SY - 6 COL RIGHT END
      75705-5602

      Mfr.#: 75705-5602

      OMO.#: OMO-75705-5602-713

      High Speed / Modular Connectors I-TRAC BP ASSY - 6 C OL GUIDE RIGHT - TIN
      75705-1603

      Mfr.#: 75705-1603

      OMO.#: OMO-75705-1603-MOLEX

      High Speed / Modular Connectors 11X6 BP HDR UNGUIDED
      757051513

      Mfr.#: 757051513

      OMO.#: OMO-757051513-393

      CONN HEADER I-TRAC 110POS PCB
      757051633

      Mfr.#: 757051633

      OMO.#: OMO-757051633-393

      CONN HEADER I-TRAC 132POS PCB
      757051833

      Mfr.#: 757051833

      OMO.#: OMO-757051833-393

      CONN HEADER I-TRAC 176POS PCB
      757054605

      Mfr.#: 757054605

      OMO.#: OMO-757054605-393

      CONN HEADER I-TRAC 132POS PCB
      757057104

      Mfr.#: 757057104

      OMO.#: OMO-757057104-393

      CONN HEADER I-TRAC 220POS PCB
      유효성
      재고:
      Available
      주문 시:
      2500
      수량 입력:
      75705-3503의 현재 가격은 참고용이며 최상의 가격을 원하시면 판매팀 [email protected]으로 문의 또는 다이렉트 이메일을 보내주십시오.
      시작
      최신 제품
      • PowerPlane Bus Bar Power Connectors
        Molex's powerplane bus bar power connectors provide compact, high-current PCB-to-bus-bar connectivity. Operating temps from -40˚C to +105˚C.
      • One-Touch LVDS FFC Connectors
        Molex introduces FFC connector with side locks and one-touch insertion provides easy operability for high-speed LVDS applications.
      • Compare 75705-3503
        757053103 vs 757053104 vs 757053503
      • FFC-FPC (SMT) Easy-On Connectors
        Ideal for tight-packaging applications, Molex’s line of FFC/FPC connectors come in various pitch options and include features to meet a wide variety of space and usage needs for applications in al
      • Micro-USB B Receptacle Waterproof SMT
        The Molex USB 2.0 Micro B IP67 waterproof option withstands post-solder reflow while preventing water ingression.
      • Ultra-Fit Power Connectors
        Molex's Ultra-Fit power connectors address the issues with mis-mated connectors, terminal backout or other assembly errors, and PCB space optimization.
      Top