XCVU7P-3FLVA2104E

Mfr. #:: XCVU7P-3FLVA2104E
제조사:: Xilinx
설명:: FPGA - Field Programmable Gate Array
수명 주기:: 이 제조업체의 새 제품입니다.
데이터 시트:: XCVU7P-3FLVA2104E 데이터 시트
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추가 정보:: XCVU7P-3FLVA2104E 추가 정보 XCVU7P-3FLVA2104E Product Details

제품 속성
속성 값

제조사:: 마이크로칩

제품 카테고리:: FPGA - 필드 프로그래머블 게이트 어레이

RoHS:: Y

입출력 수:: 202 I/O

작동 공급 전압:: 3.3 V, 5 V

최소 작동 온도:: - 40 C

최대 작동 온도:: + 85 C

장착 스타일:: SMD/SMT

패키지/케이스:: BGA-272

포장:: 쟁반

키:: 1.73 mm

길이:: 27 mm

시리즈:: MX

너비:: 27 mm

상표:: 마이크로칩 / 마이크로세미

게이트 수:: 54000

최대 작동 주파수:: 151 MHz

습기에 민감한:: 네

상품 유형:: FPGA - 필드 프로그래머블 게이트 어레이

공장 팩 수량:: 40

하위 카테고리:: 프로그래머블 로직 IC

공급 전압 - 최대:: 5.5 V

공급 전압 - 최소:: 3 V

상표명:: 액텔

Tags: XCVU7P-3, XCVU7, XCVU, XCV

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XCVU7P-3FLVA2104E 추가 정보

Virtex® UltraScale+ Field Programmable Gate Arrays: Xilinx Virtex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver the optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Virtex UltraScale+ devices provide the highest performance and integration capabilities in a FinFET node. These devices also provide 3X system-level performance per-watt compared with 7 series FPGAs. Virtex UltraScale+ devices are ideal for applications ranging from 1+Tb/s networking, smart network interface controller, machine learning, and data center interconnect, to fully integrated radar/early-warning systems. The devices have the highest transceiver bandwidth, highest digital signal processing count, and highest on-chip and in-package memory available in UltraScale architecture.

Market price

부분 #	제조	설명	재고	가격
XCVU7P-3FLVA2104E DISTI # XCVU7P-3FLVA2104E-ND	Xilinx	IC FPGA 832 I/O 2104FCBGA RoHS: Compliant Min Qty: 1 Container: Tray	Temporarily Out of Stock	1:$36,858.1800
XCVU7P-3FLVA2104EES9810 DISTI # XCVU7P-3FLVA2104EES9810	Xilinx	- Trays (Alt: XCVU7P-3FLVA2104EES9810) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0
XCVU7P-3FLVA2104EES9819 DISTI # XCVU7P-3FLVA2104EES9819	Xilinx	- Trays (Alt: XCVU7P-3FLVA2104EES9819) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0
XCVU7P-3FLVA2104EES9830 DISTI # XCVU7P-3FLVA2104EES9830	Xilinx	FPGA Virtex UltraScale+ 1724100 Cells 20nm Technology 0.9V 2104-Pin FCBGA Tray - Trays (Alt: XCVU7P-3FLVA2104EES9830) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0
XCVU7P-3FLVA2104E DISTI # 217-CVU7P-3FLVA2104E	Xilinx	FPGA - Field Programmable Gate Array RoHS: Compliant	0	1:$36,858.1700

관련 상품

영상	부분 #	설명
	Mfr.#: XCVU7P-3FLVB2104E OMO.#: OMO-XCVU7P-3FLVB2104E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU7P-3FLVA2104E OMO.#: OMO-XCVU7P-3FLVA2104E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU7P-3FLVC2104E OMO.#: OMO-XCVU7P-3FLVC2104E	FPGA - Field Programmable Gate Array
	Mfr.#: XCVU7P-3FLVA2104E OMO.#: OMO-XCVU7P-3FLVA2104E-XILINX	XCVU7P-3FLVA2104E
	Mfr.#: XCVU7P-3FLVB2104E OMO.#: OMO-XCVU7P-3FLVB2104E-XILINX	XCVU7P-3FLVB2104E
	Mfr.#: XCVU7P-3FLVC2104E OMO.#: OMO-XCVU7P-3FLVC2104E-XILINX	XCVU7P-3FLVC2104E

유효성

재고:: Available
주문 시:: 3500
수량 입력:

XCVU7P-3FLVA2104E의 현재 가격은 참고용이며 최상의 가격을 원하시면 판매팀 [email protected]으로 문의 또는 다이렉트 이메일을 보내주십시오.

참고 가격(USD)

수량
단가
내선 가격

1: ~~US$36 858.17~~; ~~US$36 858.17~~

2021년부터 반도체 공급 부족으로 인해 아래 가격은 2021년 이전 정상 가격입니다. 확인을 위해 문의를 보내주세요.

시작

XCVU7P-3 3
XCVU7 21
XCVU 305
XCV 2019

최신 제품

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Virtex-7 FPGAs from Xilinx are optimized for system performance and integration at 28 nm and offer best-in-class performance/watt fabric.
Spartan®-7 FPGA Family

Spartan-7 devices, Xilinx's addition to their cost-optimized portfolio, offer the best in class performance per watt, along with small form factor packaging.
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U200 and U250 accelerator cards from Xilinx are PCIe® Gen3x16 compatible. These cards support up to 64 GB of off-chip memory and 100GbE network interface.
Zynq® UltraScale+™ MPSoC

Xilinx's Zynq® UltraScale+™ MPSoCs include block RAM and UltraRAM, which increase performance, device utilization, and power efficiency.
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XCVU7P-3FLVA2104E

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes