DH8900CC S LJW2

DH8900CC S LJW2
Mfr. #:
DH8900CC S LJW2
제조사:
Intel
설명:
Chipsets 8900 Chipset Server FCBGA-942
수명 주기:
이 제조업체의 새 제품입니다.
데이터 시트:
DH8900CC S LJW2 데이터 시트
배달:
DHL FedEx Ups TNT EMS
지불:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
추가 정보:
DH8900CC S LJW2 추가 정보
제품 속성
속성 값
제조사:
인텔
제품 카테고리:
칩셋
RoHS:
Y
시리즈:
8900
제품:
서버 칩셋
칩셋 시리즈:
8900
유형:
PCH
코드 네임:
케이브 크릭
내장 옵션:
임베디드
PCIe 개정:
1.0
PCIe 구성:
4 Lanes
통합 그래픽:
그래픽 없이
USB 포트 수:
6
SATA 포트 수:
2
TDP - 최대:
8.5 W
최대 작동 온도:
+ 103 C
패키지/케이스:
FCBGA-942
포장:
쟁반
길이:
27 mm
너비:
27 mm
상표:
인텔
장착 스타일:
SMD/SMT
CPU 구성 - 최대:
2
습기에 민감한:
상품 유형:
칩셋
공장 팩 수량:
1
하위 카테고리:
칩셋
USB 개정:
2.0
부품 번호 별칭:
923820
Tags
DH8900CCS, DH8900C, DH8900, DH890, DH89, DH8
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
Communication Chipset 942-Pin FC-BGA Tray
***ical
Communications Chip 942-Pin FCBGA Tray
*** Electronic Components
Chipsets 8900 Chipset Server FCBGA-942
Server Chipsets
Intel's Server Chipsets provides extensive I/O support with functions and capabilities that include PCI Express, PCI Local Bus, ACPI power management, enhanced DMA controller, Serial ATA, USB host interface, integrated 10/100/1000 Gigabit Ethernet MAC, and system management bus (SMBus) with additional support for I2C devices. These chipsets provide support for Intel High Definition Audio, Rapid Storage Technology, Active Management Technology, Virtualization Technology for Directed I/O, Trusted Execution Technology, Flexible Display Interconnect, Anti-Theft Technology, and JTAG Boundary Scan support.Learn More
89xx Communication Chipsets
Intel's 89xx Communication Chipsets are a platform controller hub (PCH) that includes standard PC interfaces (e.g., PCI Express, SATA, USB, etc.) along with Intel QuickAssist Technology and I/O interfaces. The PCH can be accessed by the IA processor via two interfaces: a DMI interface that provides connectivity to the standard PC interfaces and a PCI Express interface that provides connectivity to the PCH's PCI Express End Point (EP) for Intel QuickAssist Technology and access to the GbE MACs. These interfaces are not dependent on one another and can be used independently in a system.Learn More
부분 # 제조 설명 재고 가격
DH8900CCS LJW2
DISTI # V99:2348_07313339
Intel CorporationPlatform Controller Hub Tray
RoHS: Compliant
1
  • 200:$43.3800
  • 50:$44.8000
  • 10:$46.3000
  • 1:$47.8900
DH8900CC S LJW2
DISTI # C1S325900208823
Intel CorporationCommunications Chipset Tray
RoHS: Compliant
1
  • 1:$47.8900
DH8900CC SLJW2
DISTI # DH8900CCS LJW2
Intel CorporationCommunication Chipset 942-Pin FC-BGA Tray - Trays (Alt: DH8900CCS LJW2)
RoHS: Compliant
Min Qty: 1
Container: Tray
Americas - 0
  • 1:$47.5900
  • 10:$46.9900
  • 25:$46.3900
  • 50:$45.7900
  • 100:$45.1900
  • 500:$44.5900
  • 1000:$43.9900
DH8900CC S LJW2
DISTI # 607-DH8900CCSLJW2
Intel CorporationChipsets 8900 Chipset Server FCBGA-942
RoHS: Compliant
7
  • 1:$49.2900
  • 10:$47.9400
  • 50:$46.6600
영상 부분 # 설명
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Pin Fin, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum, Black Anodized
904-27-2-12-2-B-0

Mfr.#: 904-27-2-12-2-B-0

OMO.#: OMO-904-27-2-12-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0-WAKEFIELD

HEATSINK 27X27X12MM ELLIPTICAL
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0-WAKEFIELD

Elliptical Fin Heat Sink
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
유효성
재고:
Available
주문 시:
1989
수량 입력:
DH8900CC S LJW2의 현재 가격은 참고용이며 최상의 가격을 원하시면 판매팀 [email protected]으로 문의 또는 다이렉트 이메일을 보내주십시오.
참고 가격(USD)
수량
단가
내선 가격
1
US$49.29
US$49.29
10
US$47.94
US$479.40
50
US$46.66
US$2 333.00
200
US$45.45
US$9 090.00
2021년부터 반도체 공급 부족으로 인해 아래 가격은 2021년 이전 정상 가격입니다. 확인을 위해 문의를 보내주세요.
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