XCKU15P-1FFVE1760I

Mfr. #:: XCKU15P-1FFVE1760I
제조사:: Xilinx
설명:: FPGA - Field Programmable Gate Array
수명 주기:: 이 제조업체의 새 제품입니다.
데이터 시트:: XCKU15P-1FFVE1760I 데이터 시트
배달:: DHL FedEx Ups TNT EMS
지불:: T/T Paypal Visa MoneyGram Western Union
ECAD Model:
추가 정보:: XCKU15P-1FFVE1760I 추가 정보 XCKU15P-1FFVE1760I Product Details

제품 속성
속성 값

제조사:: 자일링스

제품 카테고리:: FPGA - 필드 프로그래머블 게이트 어레이

RoHS:: Y

제품:: Virtex-6

논리 요소의 수:: 364032

입출력 수:: 600 I/O

작동 공급 전압:: 1 V

최소 작동 온도:: - 40 C

최대 작동 온도:: + 100 C

장착 스타일:: SMD/SMT

패키지/케이스:: FCBGA-1156

데이터 속도:: 6.6 Gb/s

시리즈:: XC6VLX365T

상표:: 자일링스

분산 RAM:: 4130 kbit

임베디드 블록 RAM - EBR:: 14976 kbit

최대 작동 주파수:: 1600 MHz

트랜시버 수:: 24 Transceiver

상품 유형:: FPGA - 필드 프로그래머블 게이트 어레이

공장 팩 수량:: 1

하위 카테고리:: 프로그래머블 로직 IC

상표명:: 버텍스

Tags: XCKU15P-1FFVE, XCKU15P-1, XCKU15, XCKU1, XCKU, XCK

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

XCKU15P-1FFVE1760I 평가 및 리뷰

A***i

Super recommend

2019-07-09

I***v

Everything is fine. Thank you seller

2019-05-12

XCKU15P-1FFVE1760I 설명

***roFlash: FPGA Virtex UltraScale Family 1143450 Cells 20nm Technology 0.95V/1V 1760-Pin

***inx SCT: Kintex UltraScale FPGA, Speed Grade-1, Logic Cells 1143K, E1760, RoHS

***i-Key: IC FPGA 668 I/O 1760FCBGA

XCKU15P-1FFVE1760I 추가 정보

Kintex® UltraScale+ Field Programmable Gate Arrays: Xilinx Kintex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Kintex UltraScale+ devices are ideal for both packet processing and DSP-intensive functions, and for applications ranging from wireless MIMO technology to Nx100G networking and data center.

Market price

부분 #	제조	설명	재고	가격
XCKU15P-1FFVE1760I DISTI # XCKU15P-1FFVE1760I-ND	Xilinx	XCKU15P-1FFVE1760I RoHS: Compliant Min Qty: 1 Container: Tray	Temporarily Out of Stock	1:$5,425.5300
XCKU15P-1FFVE1760I DISTI # XCKU15P-1FFVE1760I	Xilinx	FPGA Virtex UltraScale Family 1143450 Cells 20nm Technology 0.95V/1V 1760-Pin - Trays (Alt: XCKU15P-1FFVE1760I) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0	1:$5,513.0000

관련 상품

영상	부분 #	설명
	Mfr.#: XCKU15P-1FFVE1517I OMO.#: OMO-XCKU15P-1FFVE1517I	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU15P-1FFVA1156I OMO.#: OMO-XCKU15P-1FFVA1156I	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU15P-1FFVE1517E OMO.#: OMO-XCKU15P-1FFVE1517E	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU15P-1FFVA1760E OMO.#: OMO-XCKU15P-1FFVA1760E	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU15P-1FFVA1156E OMO.#: OMO-XCKU15P-1FFVA1156E-XILINX	XCKU15P-1FFVA1156E
	Mfr.#: XCKU15P-1FFVA1156I OMO.#: OMO-XCKU15P-1FFVA1156I-XILINX	XCKU15P-1FFVA1156I
	Mfr.#: XCKU15P-1FFVA1760E OMO.#: OMO-XCKU15P-1FFVA1760E-XILINX	XCKU15P-1FFVA1760E
	Mfr.#: XCKU15P-1FFVE1517E OMO.#: OMO-XCKU15P-1FFVE1517E-XILINX	XCKU15P-1FFVE1517E
	Mfr.#: XCKU15P-1FFVE1760E OMO.#: OMO-XCKU15P-1FFVE1760E-XILINX	XCKU15P-1FFVE1760E
	Mfr.#: XCKU15P-1FFVE1760I OMO.#: OMO-XCKU15P-1FFVE1760I-XILINX	XCKU15P-1FFVE1760I

유효성

재고:: Available
주문 시:: 1000
수량 입력:

XCKU15P-1FFVE1760I의 현재 가격은 참고용이며 최상의 가격을 원하시면 판매팀 [email protected]으로 문의 또는 다이렉트 이메일을 보내주십시오.

참고 가격(USD)

수량
단가
내선 가격

1: ~~US$5 424.91~~; ~~US$5 424.91~~

시작

XCKU15P-1FFVE 4
XCKU15P-1 8
XCKU15 28
XCKU1 101
XCKU 281
XCK 823

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XCKU15P-1FFVE1760I

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

A***i

I***v

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes