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| PartNumber | 104-13-322-41-770000 | 104-13-320-41-780000 | 104-13-320-41-770000 |
| Description | IC & Component Sockets 22PIN SKT .175L | IC & Component Sockets 20PIN SKT .25L | IC & Component Sockets 20PIN SKT .175L |
| Manufacturer | Mill-Max Manufacturing Corp. | Mill-Max Manufacturing Corp. | Mill-Max Manufacturing Corp. |
| Product Category | Sockets for ICs, Transistors | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
| Series | 104 | 104 | 104 |
| Type | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing |
| Packaging | Tube | Tube | Tube |
| Termination | Press-Fit | Press-Fit | Press-Fit |
| Operating Temperature | - | - | - |
| Mounting Type | Through Hole | Through Hole | Through Hole |
| Features | Open Frame | Open Frame | Open Frame |
| Housing Material | Thermoplastic | Thermoplastic | Thermoplastic |
| Number of Positions or Pins Grid | 22 (2 x 11) | 20 (2 x 10) | 20 (2 x 10) |
| Pitch Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Mating | Gold | Gold | Gold |
| Pitch Post | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Post | Gold | Gold | Gold |
| Contact Finish Thickness Mating | 30μin (0.76μm) | 30μin (0.76μm) | 30μin (0.76μm) |
| Contact Material Mating | Beryllium Copper | Beryllium Copper | Beryllium Copper |
| Contact Finish Thickness Post | 10μin (0.25μm) | 10μin (0.25μm) | 10μin (0.25μm) |
| Contact Material Post | Brass Alloy | Brass Alloy | Brass Alloy |