110-93-320-41-001000 vs 110-93-320-41-001 vs 110-93-320-41-105000

 
PartNumber110-93-320-41-001000110-93-320-41-001110-93-320-41-105000
DescriptionIC & Component Sockets 20P TIN PIN GLD CONTConnector, Dip Socket, 20 Pin, 300 Mil, PC Mount (Also Known As: 110-93-320-41-001)IC & Component Sockets 20 PIN SMT SKT 200u Sn/P
ManufacturerMill-MaxMill-Max Manufacturing Corp.-
Product CategoryIC & Component SocketsSockets for ICs, Transistors-
RoHSN--
ProductDIP / SIP Sockets--
Number of Positions20 Position--
Number of Rows2 Row--
TypeOpen FrameDIP, 0.3" (7.62mm) Row Spacing-
Pitch2.54 mm--
Termination StyleSolder Tail--
Contact PlatingGold--
Row Spacing7.62 mm--
Series0110110-
PackagingTubeTube-
Current Rating3 A--
FeaturesDIP socketOpen Frame-
Housing MaterialPolybutylene Terephthalate (PBT)Polycyclohexylenedimethylene Terephthalate (PCT), Polyester-
Voltage Rating1 kV--
BrandMill-Max--
Case StyleDIP--
Contact MaterialBeryllium Copper--
Flammability RatingUL 94 V-0--
Mounting StyleThrough Hole--
Maximum Operating Temperature+ 125 C--
Minimum Operating Temperature- 55 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity20--
SubcategoryIC & Component Sockets--
Unit Weight0.080001 oz--
Termination-Solder-
Operating Temperature--55°C ~ 125°C-
Mounting Type-Through Hole-
Number of Positions or Pins Grid-20 (2 x 10)-
Pitch Mating-0.100" (2.54mm)-
Contact Finish Mating-Gold-
Pitch Post-0.100" (2.54mm)-
Contact Finish Post-Tin-Lead-
Contact Finish Thickness Mating-30μin (0.76μm)-
Contact Material Mating-Beryllium Copper-
Contact Finish Thickness Post-200μin (5.08μm)-
Contact Material Post-Brass Alloy-
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