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210-93-624-41-001000 vs 210-93-632-41-001000 vs 210-93-628-41-001000

 
PartNumber210-93-624-41-001000210-93-632-41-001000210-93-628-41-001000
DescriptionIC & Component Sockets 24P SOLDER CLOSEDIC & Component Sockets 32P SOLDER CLOSEDIC & Component Sockets 28P SOLDER CLOSED
ManufacturerMill-MaxMill-Max Manufacturing Corp.Mill-Max Manufacturing Corp.
Product CategoryIC & Component SocketsSockets for ICs, TransistorsSockets for ICs, Transistors
RoHSN--
ProductDIP / SIP Sockets--
Number of Positions24 Position--
Number of Rows2 Row--
TypeClosed FrameDIP, 0.6" (15.24mm) Row SpacingDIP, 0.6" (15.24mm) Row Spacing
Pitch2.54 mm--
Termination StyleSolder Tail--
Contact PlatingGold--
Row Spacing15.24 mm--
Series0210210210
PackagingTubeTubeTube
Current Rating3 A--
FeaturesDIP socketClosed FrameClosed Frame
Housing MaterialPolybutylene Terephthalate (PBT)Polycyclohexylenedimethylene Terephthalate (PCT), PolyesterPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Voltage Rating1 kV--
BrandMill-Max--
Case StyleDIP--
Contact MaterialBeryllium Copper--
Flammability RatingUL 94 V-0--
Mounting StyleThrough Hole--
Maximum Operating Temperature+ 125 C--
Minimum Operating Temperature- 55 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity16--
SubcategoryIC & Component Sockets--
Termination-SolderSolder
Operating Temperature--55°C ~ 125°C-55°C ~ 125°C
Mounting Type-Through HoleThrough Hole
Number of Positions or Pins Grid-32 (2 x 16)28 (2 x 14)
Pitch Mating-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Mating-GoldGold
Pitch Post-0.100" (2.54mm)0.100" (2.54mm)
Contact Finish Post-Tin-LeadTin-Lead
Contact Finish Thickness Mating-30μin (0.76μm)30μin (0.76μm)
Contact Material Mating-Beryllium CopperBeryllium Copper
Contact Finish Thickness Post-200μin (5.08μm)200μin (5.08μm)
Contact Material Post-Brass AlloyBrass Alloy
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