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| PartNumber | 268-5401-50-0000 | 268-5401-00-1102JH | 268-5401-11-1102JH |
| Description | IC & Component Sockets LID U-SHAPE | IC & Component Sockets CHIP CARRIER LCC WITH FULL LID | IC & Component Sockets END USE-LCC 24.13+/-0.25 A BASE |
| Manufacturer | 3M | 3M | 3M |
| Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
| RoHS | Y | N | - |
| Product | Zero Insertion Force (ZIF) Sockets | Zero Insertion Force (ZIF) Sockets | - |
| Termination Style | Through Hole | Through Hole | - |
| Brand | 3M Electronic Solutions Division | 3M Electronic Solutions Division | - |
| Product Type | IC & Component Sockets | IC & Component Sockets | - |
| Factory Pack Quantity | 100 | 100 | - |
| Subcategory | IC & Component Sockets | IC & Component Sockets | - |
| Part # Aliases | 05113523625 JE150085726 | 05111526693 JE150379194 | - |
| Unit Weight | 1 lb | 0.159973 oz | - |
| Number of Positions | - | 68 Position | - |
| Pitch | - | 2.54 mm | - |
| Contact Plating | - | Nickel with Gold Flash | - |
| Mounting Style | - | Through Hole | - |
| Maximum Operating Temperature | - | + 105 C | - |
| Minimum Operating Temperature | - | - 55 C | - |
| Series | - | - | OEM |
| Type | - | - | CLCC |
| Packaging | - | - | Tray |
| Termination | - | - | Solder |
| Operating Temperature | - | - | -55°C ~ 105°C |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Closed Frame |
| Housing Material | - | - | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | - | - | 68 (4 x 17) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Gold |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Gold |
| Contact Finish Thickness Mating | - | - | 30μin (0.76μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 30μin (0.76μm) |
| Contact Material Post | - | - | Beryllium Copper |