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| PartNumber | 808-AG11D-ES | 808-AG11D | 808-AG11D-ES-LF |
| Description | IC & Component Sockets 8 PIN ECONOMY | IC & Component Sockets SOCKET ASSEMBLY | IC & Component Sockets DIP .3CL 08P S&R OFRM AU/SN |
| Manufacturer | TE Connectivity | TE Connectivity | TE Connectivity AMP Connectors |
| Product Category | IC & Component Sockets | IC & Component Sockets | Sockets for ICs, Transistors |
| RoHS | N | N | - |
| Pitch | 2.54 mm | - | - |
| Contact Plating | Gold | Gold | - |
| Brand | TE Connectivity / AMP | TE Connectivity / AMP | - |
| Contact Material | Beryllium Copper | Beryllium Copper | - |
| Mounting Style | PCB | SMD/SMT | - |
| Maximum Operating Temperature | + 125 C | - | - |
| Minimum Operating Temperature | - 55 C | - | - |
| Product Type | IC & Component Sockets | IC & Component Sockets | - |
| Factory Pack Quantity | 60 | 60 | - |
| Subcategory | IC & Component Sockets | IC & Component Sockets | - |
| Part # Aliases | 1437539-5 | 1437537-8 | - |
| Product | - | DIP / SIP Sockets | - |
| Packaging | - | Tray | Tube |
| Series | - | - | 800 |
| Type | - | - | DIP, 0.3" (7.62mm) Row Spacing |
| Termination | - | - | Solder |
| Operating Temperature | - | - | -55°C ~ 105°C |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Open Frame |
| Housing Material | - | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Number of Positions or Pins Grid | - | - | 8 (2 x 4) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Gold |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Gold |
| Contact Finish Thickness Mating | - | - | 20μin (0.51μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 20μin (0.51μm) |
| Contact Material Post | - | - | Copper |