816-AG10D vs 816-AG10D-ES vs 816-AG11D

 
PartNumber816-AG10D816-AG10D-ES816-AG11D
DescriptionIC & Component Sockets PC MOUNT 16 PINSCONN IC DIP SOCKET 16POS GOLDIC & Component Sockets 16 POS THRU HOLE
ManufacturerTE Connectivity-TE Connectivity AMP Connectors
Product CategoryIC & Component Sockets-Sockets for ICs, Transistors
RoHSE--
ProductSocket Pins--
Number of Positions16 Position--
Number of Rows2 Row--
Pitch2.54 mm--
Contact PlatingGold--
PackagingTube-Tube
BrandTE Connectivity / AMP--
Contact MaterialBeryllium Copper--
Flammability RatingUL 94V-0--
Mounting StylePCB--
Maximum Operating Temperature+ 125 C--
Minimum Operating Temperature0 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity30--
SubcategoryIC & Component Sockets--
Part # Aliases3-1437537-7--
Unit Weight0.040001 oz--
Series--800
Type--DIP, 0.3" (7.62mm) Row Spacing
Termination--Solder
Operating Temperature---55°C ~ 105°C
Mounting Type--Through Hole
Features--Open Frame
Housing Material--Polyester
Number of Positions or Pins Grid--16 (2 x 8)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post---
Contact Finish Thickness Mating--25μin (0.63μm)
Contact Material Mating--Copper Alloy
Contact Finish Thickness Post---
Contact Material Post---
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