 |  |  | |
| PartNumber | 114991561 | 114991560 | 114991438 |
| Description | Seeed Studio Accessories Copper HeatSink Cooling Kit for Raspberry Pi | Seeed Studio Accessories Armor Case for Raspberry Pi 3 Model B | Interface Development Tools OBD-II CAN-BUS Development Kit |
| Manufacturer | Seeed Studio | Seeed Studio | Seeed Studio |
| Product Category | Seeed Studio Accessories | Seeed Studio Accessories | Interface Development Tools |
| RoHS | Y | Y | - |
| Product | Accessories | Enclosures | Development Kits |
| Type | Copper Heatsink Cooling Kit | Armor Case | CAN-BUS |
| Brand | Seeed Studio | Seeed Studio | Seeed Studio |
| For Use With | Raspberry Pi | Raspberry Pi 3 Model B | - |
| Product Type | Accessories | Accessories | Interface Development Tools |
| Factory Pack Quantity | 1 | 1 | 1 |
| Subcategory | Supplies | Supplies | Development Tools |
| Tool Is For Evaluation Of | - | - | MCP2551, MCP2515 |
| Dimensions | - | - | 110 mm x 83 mm x 43 mm |
| Interface Type | - | - | Serial |
