 |  | | |
| PartNumber | 24-6575-10 | 24-6575-16 | 24-6575-11 |
| Description | IC & Component Sockets QUICK RELEASE 24 PIN TIN | IC & Component Sockets QUICK RELEASE 24 PIN NICKEL | IC & Component Sockets QUICK RELEASE 24 PIN GOLD |
| Manufacturer | Aries Electronics | - | Aries Electronics |
| Product Category | IC & Component Sockets | - | Sockets for ICs, Transistors |
| RoHS | Y | - | - |
| Product | Zero Insertion Force (ZIF) Sockets | - | - |
| Number of Positions | 24 Position | - | - |
| Contact Plating | Tin | - | - |
| Series | X57X | - | 57 |
| Brand | Aries Electronics | - | - |
| Mounting Style | PCB | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 12 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Type | - | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Packaging | - | - | Bulk |
| Termination | - | - | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Closed Frame |
| Housing Material | - | - | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | - | - | 24 (2 x 12) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Tin |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Tin |
| Contact Finish Thickness Mating | - | - | 200μin (5.08μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 200μin (5.08μm) |
| Contact Material Post | - | - | Beryllium Copper |
| 제조사 | 부분 # | 설명 | RFQ |
|---|---|---|---|
Aries Electronics |
24-6575-10 | IC & Component Sockets QUICK RELEASE 24 PIN TIN | |
| 24-6575-18 | IC & Component Sockets QUICK RELEASE 24 PIN HI TEMP | ||
| 24-6575-18 | IC & Component Sockets QUICK RELEASE 24 PIN HI TEMP | ||
| 24-6575-16 | IC & Component Sockets QUICK RELEASE 24 PIN NICKEL | ||
| 24-6575-11 | IC & Component Sockets QUICK RELEASE 24 PIN GOLD | ||
| 24-6575-10 | IC & Component Sockets QUICK RELEASE 24 PIN TIN |