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| PartNumber | DIP632-001BLF | DIP632-011B | DIP632-014B |
| Description | CONN IC DIP SOCKET 32POS GOLD | IC & Component Sockets 32C OPEN FRAME | IC & Component Sockets 32C OPEN FRAME |
| Manufacturer | Amphenol FCI | - | - |
| Product Category | Sockets for ICs, Transistors | - | - |
| Series | - | - | - |
| Type | DIP, 0.6" (15.24mm) Row Spacing | - | - |
| Packaging | Tube | - | - |
| Termination | Solder | - | - |
| Operating Temperature | - | - | - |
| Mounting Type | Through Hole | - | - |
| Features | Open Frame | - | - |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | - |
| Number of Positions or Pins Grid | 32 (2 x 16) | - | - |
| Pitch Mating | 0.100" (2.54mm) | - | - |
| Contact Finish Mating | Gold | - | - |
| Pitch Post | 0.100" (2.54mm) | - | - |
| Contact Finish Post | Tin | - | - |
| Contact Finish Thickness Mating | 30μin (0.76μm) | - | - |
| Contact Material Mating | Beryllium Copper | - | - |
| Contact Finish Thickness Post | 200μin (5.08μm) | - | - |
| Contact Material Post | Brass | - | - |