 |  | | |
| PartNumber | DS34T108GN+ | DS34T108GN | DS34T108G |
| Description | Telecom Interface ICs Octal TDM Over Packet Chip | Ethernet ICs Octal TDM Over Packet Chip | |
| Manufacturer | Maxim Integrated | Maxim Integrated | - |
| Product Category | Telecom Interface ICs | Specialized ICs | - |
| RoHS | Y | - | - |
| Product | TDM-over-Packets | - | - |
| Supply Voltage Max | 3.465 V | - | - |
| Supply Voltage Min | 3.135 V | - | - |
| Minimum Operating Temperature | - 40 C | - | - |
| Maximum Operating Temperature | + 85 C | - | - |
| Mounting Style | SMD/SMT | - | - |
| Package / Case | HSBGA-484 | - | - |
| Packaging | Tube | Tray | - |
| Data Rate | 10 Mb/s, 100 Mb/s | - | - |
| Series | DS34T108GN | - | - |
| Brand | Maxim Integrated | - | - |
| Number of Channels | 8 Channel | - | - |
| Moisture Sensitive | Yes | - | - |
| Product Type | Telecom Interface ICs | - | - |
| Factory Pack Quantity | 60 | - | - |
| Subcategory | Interface ICs | - | - |
| Part # Aliases | 90-34T10+8N0 DS34T108GN | - | - |
| Type | - | TDM (Time Division Multiplexing) | - |
| Package Case | - | 484-BGA Exposed Pad | - |
| Mounting Type | - | Surface Mount | - |
| Applications | - | Data Transport | - |
| Supplier Device Package | - | 484-HSBGA (23x23) | - |
| 제조사 | 부분 # | 설명 | RFQ |
|---|---|---|---|
Maxim Integrated |
DS34T108GN+ | Telecom Interface ICs Octal TDM Over Packet Chip | |
| DS34T108GN+ | Ethernet ICs Octal TDM Over Packet Chip | ||
| DS34T108GN | Ethernet ICs Octal TDM Over Packet Chip | ||
| DS34T108G | 신규 및 오리지널 |