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ECB002

ECB00206 vs ECB00208-03-GP vs ECB00251ZCN-Y3

 
PartNumberECB00206ECB00208-03-GPECB00251ZCN-Y3
DescriptionLPDDR2 4G DIE 128MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB00251ZCN-Y3)
제조사 부분 # 설명 RFQ
ECB00206 신규 및 오리지널
ECB00208-03-GP 신규 및 오리지널
ECB00251ZCN-Y3 LPDDR2 4G DIE 128MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB00251ZCN-Y3)
ECB0027201GP 신규 및 오리지널
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