 | | | |
| PartNumber | W71NW10GC1HW | W71NW10GC1DW | W71NW10GC3DW |
| Description | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x16 | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x16 | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x32 |
| Manufacturer | Winbond | Winbond | Winbond |
| Product Category | Multichip Packages | Multichip Packages | Multichip Packages |
| RoHS | Y | Y | Y |
| Type | NAND Flash, LPDDR1 | NAND Flash, LPDDR1 | NAND Flash, LPDDR1 |
| Memory Size | 1 Gbit, 512 Mbit | 1 Gbit, 512 Mbit | 1 Gbit, 512 Mbit |
| Series | W71NW10GC | W71NW10GC | W71NW10GC |
| Mounting Style | SMD/SMT | SMD/SMT | SMD/SMT |
| Maximum Clock Frequency | 29 MHz, 200 MHz | 29 MHz, 200 MHz | 29 MHz, 200 MHz |
| Minimum Operating Temperature | - 40 C | - 40 C | - 40 C |
| Maximum Operating Temperature | + 85 C | + 85 C | + 85 C |
| Organization | 128 M x 8, 32 M x 16 | 64 M x 16, 32 M x 16 | 128 M x 8, 16 M x 32 |
| Packaging | Tray | Tray | Tray |
| Brand | Winbond | Winbond | Winbond |
| Data Bus Width | 8 bit, 16 bit | 16 bit | 8 bit, 32 bit |
| Moisture Sensitive | Yes | Yes | Yes |
| Product Type | Multichip Packages | Multichip Packages | Multichip Packages |
| Factory Pack Quantity | 136 | 240 | 240 |
| Subcategory | Memory & Data Storage | Memory & Data Storage | Memory & Data Storage |
| Supply Voltage Max | 1.95 V | 1.95 V | 1.95 V |
| Supply Voltage Min | 1.7 V | 1.7 V | 1.7 V |
| 제조사 | 부분 # | 설명 | RFQ |
|---|---|---|---|
Winbond |
W71NW10GC3GW | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x32 | |
| W71NW10GC1HW | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x16 | ||
| W71NW10GC1DW | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x16 | ||
| W71NW10GC3DW | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x32 | ||
| W71NW10GC1HW | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x16 | ||
| W71NW10GC3DW | Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x8/x32 |