W71NW11

W71NW11GC1HW vs W71NW11GBADW vs W71NW11GC1DW

 
PartNumberW71NW11GC1HWW71NW11GBADWW71NW11GC1DW
DescriptionMultichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x32Multichip Packages 1G-bit 1.8V NAND + 256Mb LPDDR1 MCP x16/x16Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
ManufacturerWinbondWinbondWinbond
Product CategoryMultichip PackagesMultichip PackagesMultichip Packages
RoHSYYY
TypeNAND Flash, LPDDR1NAND Flash, LPDDR1NAND Flash, LPDDR1
Memory Size1 Gbit, 512 Mbit1 Gbit, 256 Mbit1 Gbit, 512 Mbit
SeriesW71NW11GCW71NW11GBW71NW11GC
Mounting StyleSMD/SMTSMD/SMTSMD/SMT
Maximum Clock Frequency29 MHz, 200 MHz-29 MHz, 200 MHz
Minimum Operating Temperature- 40 C-- 40 C
Maximum Operating Temperature+ 85 C-+ 85 C
Organization64 M x 16, 32 M x 1664 M x 16, 16 M x 1664 M x 16, 32 M x 16
PackagingTrayTrayTray
BrandWinbondWinbondWinbond
Data Bus Width16 bit16 bit16 bit
Moisture SensitiveYesYesYes
Product TypeMultichip PackagesMultichip PackagesMultichip Packages
Factory Pack Quantity136240240
SubcategoryMemory & Data StorageMemory & Data StorageMemory & Data Storage
Supply Voltage Max1.95 V1.95 V1.95 V
Supply Voltage Min1.7 V1.7 V1.7 V
제조사 부분 # 설명 RFQ
Winbond
Winbond
W71NW11GC1HW Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x32
W71NW11GBADW Multichip Packages 1G-bit 1.8V NAND + 256Mb LPDDR1 MCP x16/x16
W71NW11GC1DW Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
W71NW11HC1DW Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
W71NW11GE1EW Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x16/x16
W71NW11GF1EW Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16
W71NW11GC1DW 신규 및 오리지널
W71NW11GC1DWT 신규 및 오리지널
W71NW11GCDW 신규 및 오리지널
W71NW11GE1EW Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x16/x16
W71NW11GF1EW Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x16/x16
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