W71NW11GC1

W71NW11GC1HW vs W71NW11GC1DW vs W71NW11GC1DWT

 
PartNumberW71NW11GC1HWW71NW11GC1DWW71NW11GC1DWT
DescriptionMultichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x32Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
ManufacturerWinbondWinbond-
Product CategoryMultichip PackagesMultichip Packages-
RoHSYY-
TypeNAND Flash, LPDDR1NAND Flash, LPDDR1-
Memory Size1 Gbit, 512 Mbit1 Gbit, 512 Mbit-
SeriesW71NW11GCW71NW11GC-
Mounting StyleSMD/SMTSMD/SMT-
Maximum Clock Frequency29 MHz, 200 MHz29 MHz, 200 MHz-
Minimum Operating Temperature- 40 C- 40 C-
Maximum Operating Temperature+ 85 C+ 85 C-
Organization64 M x 16, 32 M x 1664 M x 16, 32 M x 16-
PackagingTrayTray-
BrandWinbondWinbond-
Data Bus Width16 bit16 bit-
Moisture SensitiveYesYes-
Product TypeMultichip PackagesMultichip Packages-
Factory Pack Quantity136240-
SubcategoryMemory & Data StorageMemory & Data Storage-
Supply Voltage Max1.95 V1.95 V-
Supply Voltage Min1.7 V1.7 V-
제조사 부분 # 설명 RFQ
Winbond
Winbond
W71NW11GC1HW Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x32
W71NW11GC1DW Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
W71NW11GC1DW 신규 및 오리지널
W71NW11GC1DWT 신규 및 오리지널
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