GIG-Array® Connectors

By Amphenol ICC 459

GIG-Array® Connectors

Amphenol ICC's GIG-Array connector is designed to meet the needs of up to 10 Gb/s applications requiring up to 296 signal pins per connector. Amphenol ICC's long tradition as a BGA connector innovator assures expertise and reliability in the GIG-Array BGA design. The combination of multiple stack heights (15 mm to 40 mm) and multiple sizes (104, 200, and 296 signals) utilizing a 100 Ω differential matched impedance design allows for optimal design flexibility while yielding less than 1% cross-talk performance.

Amphenol ICC's patented BGA design is supported by fully automated quality-control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality-control product audits, and statistical-process controls are all a part of Amphenol ICC's state-of-the-art manufacturing facility.

Features
  • RoHS compliant (lead free) options are available
  • Ball-grid array (BGA) termination for process friendly attachment
  • 1 mm x 0.65 mm, BGA interface pitch optimizes routing and electrical performance
  • Stack heights available from 15 mm to 40 mm provide mezzanine design flexibility
  • Polarized design assures proper mating of the connector
  • Dual-beam signal contacts provide two points of contact, increasing product reliability
  • 100 Ω differential pair matched impedance assures consistent high-speed performance
  • Connector sizes of 104, 200, and 296 signals providing 62 signal contacts per linear cm (158 signal contacts per linear inch) allow for optimization of board space and signal requirements
  • Up to 10 Gbs/s differential pair performance
  • Very low cross-talk (VLC) design of less than 1% allows for required signal-integrity performance
Applications
  • Communications
    • Transmission
    • Access
    • Switching
    • Optics
    • Networking
  • Data
    • Servers
    • Storage
  • Industrial and instrumentation
    • Industrial controls and equipment
Specifications
  • Housing: liquid-crystal polymer
  • Contact: high-strength copper alloy
  • Plating: Au, GXT®
  • Durability: 25 cycles
  • Contact wipe: 2.00 mm nominal
  • Current rating: 1 A/contact < 30°C
  • Dielectric withstanding voltage: 500 VAC
  • Withstanding voltage: 167 VAC (max.)
  • Low-level contact resistance:
    • < 20 mΩ for 15 mm mated height
    • < 31 mΩ for 28 mm mated height
  • Propagation delay:
    • 55 pS for 15 mm mated height
    • 115 pS for 28 mm mated height
  • Differential impedance: 100 ± 10%Ω
  • Near-end cross-talk at 100 pS: < 3%

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