TVS Diodes with Ultra-Low Channel Input Capacitanc

By Diodes Incorporated 82

TVS Diodes with Ultra-Low Channel Input Capacitanc

Diodes Incorporated introduces two TVS devices with ultra-low channel input capacitance (CI/O): D3V3X4U10LP and D3V3F4U10LP. These devices are designed to provide data line protection for the sensitive mixed signal SoCs (system-on-chip) which are manufactured on the low-power advanced process nodes and are compatible to the high-speed interface standards like USB, HDMI®, DisplayPort™. With reverse breakdown voltage (VBR) at 6.2 V (typical), peak pulse current (IPP) per IEC61000-4-5 as much as 5 A, and ability to withstand ESD strike (VESD) per IEC61000-42 up to ±12 kV for air and contact discharge, these devices meet or exceed all requirements for protecting the high-speed interface like USB Type-C™ from possible ESD hazards. The ultra-low channel input capacitance (CI/O) at 0.45 pF to 0.5 pF (typical) enables good signal integrity for reliable data transfers over  high-speed interfaces. Housed in the low-profile and fully green DFN2501-10 package, these devices are well-suited to the fully automated manufacturing environment. With Z height at less than 0.58 mm (typical), they can be easily applied in systems where space is at a premium such as computers and peripherals, smartphones, 4K/8K monitors, audio/visual equipment, and AR/VR equipment.

Features
  • Low reverse working and clamping voltage
    • With reverse working voltage (VRWM) at 3.3 V (max.), reverse clamping voltage (VC) of 3.5 A (typ.) for IPP = 5 A, these devices ensure the mixed signal SoC being protected operates comfortable within the safe limits
  • IEC61000-4-2 and IEC61000-4-5 compliance
    • 4 channels of I/O ports with protection for IEC61000-4-2 (ESD) up to ±12 kV air and contract, IEC61000-4-5 (lightning) up to peak pulse current (IPP) of 5 A (8/20 µs)
  • Ultra-low channel input capacitance
    • With the input capacitance as low as 0.45 pF, the insertion loss over any pair of high-speed differential transmission lines is minimized
  • Low-profile DFN2510 package
    • The combination of small footprint (2.5 mm x 1.0 mm) and ultra-low Z height (0.58 mm) allow these devices to be applied in very tight environment
Applications
  • Smartphones
  • 4K/8K monitors
  • AR/VR equipment
  • Computers and peripherals
  • Audio/visual equipment

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